DMG Mori ULTRASONIC 20 linear 3rd Generation
Key Specifications
X Travel
Y Travel
Z Travel
Max Spindle
Max Workpiece ⌀
spindle interface
Overview
The DMG Mori ULTRASONIC 20 linear 3rd Generation is a compact, ultra-precision 5-axis machining center built for processing advanced ceramics, glass, sapphire, silicon carbide, and other hard-brittle materials. The ULTRASONIC technology superimposes high-frequency oscillations (typically 20-50 kHz) onto the rotating tool, reducing process forces by up to 50%.
The machine provides axis travels of 220 x 370 x 290 mm (8.7 x 14.6 x 11.4 in) with linear drives on all axes delivering acceleration up to 1.2 g. The standard spindle runs at 42,000 RPM through an HSK-E32 interface, with an optional 60,000 RPM configuration. The A-axis swivels from -93 to +130 degrees, and the C-axis rotates at 150 RPM standard (1,500 RPM optional).
Workpiece capacity is 220 x 302 mm with maximum diameter of 220 mm and table load of 15 kg. This targets watch, medical implant, semiconductor, and optical industries. The 3rd Generation brings improved ultrasonic amplitude control with automatic frequency detection up to 15 micrometers.
Runs on Siemens control with CELOS interface. Pricing starts around $400,000 and can exceed $600,000. No real direct competitor exists at this size.
Full Specifications
| Parameter | Value |
|---|---|
| X-Axis Travel | 220 mm (8.7 in) |
| Y-Axis Travel | 370 mm (14.6 in) |
| Z-Axis Travel | 290 mm (11.4 in) |
| Max Spindle Speed | 42,000 RPM (60,000 RPM optional) |
| Spindle Interface | HSK-E32 |
| A Axis Swivel | -93 to +130 degrees |
| C Axis Speed | 150 RPM (1,500 RPM optional) |
| Max Workpiece Diameter | 220 mm (8.7 in) |
| Max Workpiece Length | 302 mm (11.9 in) |
| Max Workpiece Height | 283 mm (11.1 in) |
| Max Table Load | 15 kg (33 lb) |
| Ultrasonic Amplitude | Up to 15 micrometers |
| Acceleration | Up to 1.2 g (linear drives) |
| CNC Control | CELOS with Siemens SINUMERIK |
| 220 Mm | 8.7 in. |
| 370 Mm | 14.6 in. |
| 290 Mm | 11.4 in. |
| 302 Mm | 11.9 in. |
| 283 Mm | 11.1 in. |
| 15 Kg | 33.1 lbs. |
Specifications sourced from us.dmgmori.com — verified 2026-03-28
Strengths & Limitations
Strengths
- ULTRASONIC technology reduces process forces by up to 50% for crack-free machining of ceramics, glass, sapphire, and silicon carbide
- 42,000 RPM standard spindle with 60,000 RPM option handles micro-tooling down to sub-millimeter diameters
- Linear drives deliver 1.2 g acceleration and exceptional positioning accuracy
- Wide A-axis swivel range (-93 to +130 degrees) provides superior 5-axis access
- Automatic frequency detection maintains consistent performance as tools wear
- No real direct competitor at this size and capability level
Limitations
- Starting at $400K, price-to-envelope ratio only makes sense for high-value parts
- 15 kg table load limits this to small parts
- HSK-E32 tooling is specialized and expensive
- Ultrasonic actuator toolholders add $1,000-$3,000 per holder
Best For
Frequently Asked Questions
01
Technical ceramics (alumina, zirconia, silicon nitride), glass, sapphire, silicon carbide, and piezoelectric ceramics. Ultrasonic oscillation reduces forces by up to 50%.
02
Tool rotation is superimposed with 20-50 kHz axial oscillations at up to 15 micrometers amplitude, reducing forces, heat, and crack propagation.
03
Specialized linear drives, ultra-high-speed spindle, precision ultrasonic actuation, and sub-micron positioning. Competes with grinding centers, not VMCs.
04
Yes, but not economically justified. Purpose-built for materials benefiting from ultrasonic assistance.
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